Joining Hands in Silicon, Guiding the Future: International Integrated Circuit Exhibition and Conference (IIC Shenzhen 2025) Grandly Opens; "Global Electronics Achievement Awards" Ceremoniously Unveiled

[November 25, 2025 – Shenzhen] Hosted by AspenCore—a renowned global media group in the field of electronic technology—the "International IC Exhibition and Conference" (IIC Shenzhen 2025) grandly opened on November 25, 2025, at the Sheraton Shenzhen Futian Hotel. Spanning two days, IIC Shenzhen 2025 features a diverse array of activities—including annual showcases of innovative products, technical exchanges, high-level industry summits, and specialized thematic forums—bringing together global expertise to explore new pathways and boundless possibilities for the future development of the electronics industry.

The opening day attracted a large turnout of industry professionals, creating a vibrant atmosphere that vividly demonstrated the robust vitality and strong momentum of the semiconductor and electronics sectors. This year's exhibition brings together leading enterprises and innovative forces from across the entire semiconductor supply chain—both upstream and downstream—to comprehensively showcase the latest technological achievements and practical applications in critical segments such as chip design, manufacturing, packaging and testing, and end-use applications, from both domestic and international markets.

The summit venue features dedicated zones for industry innovation applications and product displays, attracting participation from numerous renowned industry vendors, including: Cima Technology Group, Mingguan International, Shenzhen Huijiacheng Electronics Co., Ltd., Shenzhen Kaixinda Technology Co., Ltd., Keysight Technologies (China) Co., Ltd., SmartSens Technology (Shanghai) Co., Ltd., Shenzhen Ruifan Microelectronics Technology Co., Ltd., Shanghai Yueyue Electronics, Weide International Enterprise Co., Ltd., Biaoxin Technology Shenzhen Co., Ltd., Shenzhen Guqin Technology Co., Ltd., Juxin Youpin, Sender International Co., Ltd., Yunhan IC City (Shanghai) Internet Technology Co., Ltd., Jiangsu Runshi Technology Co., Ltd., Shenzhen Sinuoxin Electronics Co., Ltd., Shenzhen Hongdingye Technology Co., Ltd., Hangzhou Jinghua Microelectronics Co., Ltd., Shenzhen Zhengpinzhiyuan Electronics Co., Ltd., Shenzhen Paimingxincheng Electronics Co., Ltd., Meite International Co., Ltd., Lianke Devices, and Beijing Jingyuxing Technology Co., Ltd.

In addition to the innovative product exhibition area, the high-level industry summits and a series of specialized thematic forums also stand as key highlights of this grand event.

In 2025—an era characterized by the deep convergence of digital transformation and intelligent technologies—"Digital Embodiment" is rapidly emerging as a strategic focal point in global technological competition, serving as a pivotal vehicle for the interaction between artificial intelligence and the physical world.

During his opening remarks at the summit, Mr. Yorbe Zhang (Zhang Yubo), General Manager and Chief Analyst for AspenCore Asia-Pacific, stated: "Digital Embodiment is the key to achieving the fusion of 'cognition' and 'action' in the AI era; it marks AI's transition from 'cognitive intelligence' to 'action intelligence.' It not only reshapes technological boundaries but will also profoundly impact industrial structures, economic models, and social life. Digital Embodiment is currently in its early stages—characterized by a combination of technological breakthroughs and scenario-specific commercialization. While industrial manufacturing has been the first sector to see practical implementation, realizing widespread application and achieving general intelligence still requires addressing core challenges related to perception, decision-making, and energy consumption costs. Global technological competition is shifting from large-scale models toward embodied intelligence; whoever masters the core technologies will hold the authoritative voice in future industries. China has already incorporated embodied intelligence into its policy planning, designating it as a crucial pillar for fostering 'new quality productive forces' in the future. As one of the leading global institutional media organizations, AspenCore has historically stood at the forefront of technological advancement, and we hope this summit will provide the industry community with valuable insights and information."

Centered on the theme of "Digital Embodiment," the "Global CEO Summit" brought together numerous industry leaders, experts, and scholars to engage in in-depth discussions on cutting-edge trends—including AI, edge computing, and intelligent hardware—thereby fostering collaborative innovation and ecosystem building within the industry.

Distinguished speakers included: Dr. Wei Shaojun, Chairman of the IC Design Branch of the China Semiconductor Industry Association (CSIA) and Professor at the School of Integrated Circuits, Tsinghua University; Peng Qihuang, Global Senior Vice President and President of the Asia-Pacific Region at Siemens EDA; Nitin Dahad, Executive Editor at EE Times; Liang Yali, Executive Vice President at Arm China; Jin Fangqi, Senior Vice President at SmartSens Technology; Dr. Wang Qi, Founder, Chairman, and General Manager of Innodada (Chengdu) Electronics Technology Co., Ltd.; Philippe Notton, CEO and Founder of SiPearl; Wang Yang, Board Director, COO, Executive Vice President, and Head of Global Sales at VeriSilicon; Lin Yongyu, Chairman and General Manager of StarFive Technology Co., Ltd.; Wu Xiongang, Chairman of CoreLab Technology; Xu Jiehong, General Manager of the Embedded IoT Platform Business Group at Advantech (China); and Bi Yalei, Head of the Shenzhen New Generation Information and Communication Industry Cluster Promotion Agency and Secretary-General of the Shenzhen Robotics Association.

The summit’s roundtable discussion, themed "Digital and Analog: A New Landscape in the Era of Intelligence," featured in-depth discussions with invited guests. Participants included: Lin Yongyu, Chairman and General Manager of StarFive Technology Co., Ltd.; Tang Zhimin, Dean and Chair Professor at the School of Computing and Microelectronics, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences; Wang Junyu, Co-CEO of Chipsea Technology (Shenzhen) Co., Ltd.; Shang Deming, Head of Sales for the Asia-Pacific Region at Pragmatic Semiconductor; Yan Guangliang, Deputy General Manager at Runstone Technology; and Du Xin, Senior Sales Director at Imagination Technologies.

At the summit, leading global speakers gathered to share the latest technology trends, key challenges, and strategic solutions, presenting attendees with a vision of the boundless potential at the edge.

On the morning of the 25th, the summit hosted the "30th Forum on High-Efficiency Power Management and Wide-Bandgap Semiconductor Technology Applications" concurrently. Technical experts from companies such as Texas Instruments, Innoscience, Renesas Electronics, Biyi Microelectronics, and AOS took the stage in succession to deliver presentations.

That same afternoon, the "AI + Consumer Electronics Application Forum" followed, featuring presentations from experts representing companies including VR Tuoluo, STMicroelectronics, Winbond Electronics, Keysight Technologies, StarFive Technology, and Tencent Cloud.

This year's summit features simultaneous video live streaming across multiple media channels. Through a hybrid online-and-offline format, the event shares its boundless excitement and highlights with a global audience in real-time.

Tomorrow marks the final day of IIC Shenzhen. In addition to the exhibition, the event will host a series of concurrent activities, including the "2025 Global Distribution & Supply Chain Leaders Summit" and the "International Industry 4.0 Technology & Application Forum." In the evening, the "2025 Global Electronic Components Distributor Excellence Awards" will be presented. We invite you to stay tuned and join us for more exciting highlights!

Winners of the 2025 World Electronics Achievement Awards Revealed

That evening, the "World Electronics Achievement Awards" were presented. This award program aims to identify and honor companies and executives who have made outstanding contributions to driving innovation within the global electronics industry. For the winning companies and individuals, receiving a World Electronics Achievement Award is a distinguished honor. The companies, executives, and products nominated across the various categories represent industry leaders, fully demonstrating their preeminent status and exceptional performance within the sector.

The following winners were selected jointly by a judging committee—comprising AspenCore’s senior global industry analysts—and a user base drawn from Asia, the Americas, and Europe. The list of 2025 award winners is as follows:

Company Awards & Industry Analyst Recommendations

(Winners within each category are listed in no particular order.)

Innovative Product of the Year Awards

(Winners within each category are listed in no particular order.)

About AspenCore

AspenCore is a leading global technology media organization in the field of electronic engineering. Its core mission is to provide electronic engineers, technical professionals, procurement specialists, and management personnel with the highest quality content to spark their creativity, thereby fostering the growth and development of the entire electronics industry market.

At the same time, AspenCore’s highly credible media channels provide technology suppliers with an excellent platform to reach technology decision-makers.